The Association for Packaging and Processing Technologies (PMMI) announced that the Active & Intelligent Packaging Industry Association (AIPIA) will hold its third AIPIA World Congress alongside PACK EXPO International 2014 from Nov. 2-4, 2014.
“PACK EXPO International is an outstanding showcase for the latest developments in packaging and processing technologies, so it’s a very logical step to incorporate AIPIA’s event,” said Charles D. Yuska, president and CEO, PMMI. “The AIPIA World Congress will address some very exciting and cutting-edge technologies in the packaging world. Active and intelligent packaging is taking packaging into new areas which our exhibitors and visitors need fully to understand. ”
Located at McCormick Place in Chicago, PACK EXPO International 2014 and the co-located Pharma EXPO are expected to draw 50,000 visitors to see 2,000 exhibiting companies across 1.2 million net square feet of exhibit space.
“PACK EXPO International is one of the top events on the global packaging calendar and a fantastic location for our next event,” said Eef de Ferrante, director, AIPIA. “Being part of PACK EXPO underscores the status the AIPIA World Congress has already achieved and reflects the rise of active and intelligent packaging.”
Featuring a display area in addition to its conference sessions, the AIPIA World Congress will allow delegates will receive complimentary registration to PACK EXPO International and Pharma EXPO.
“Over the last 10 years, even during the global economic slowdown, PACK EXPO International has expanded and evolved to become the number one event for processing and packaging technologies,” said de Ferrante. “We are very excited about the prospect of holding the Congress in the USA for the first time and could not have chosen a better partner than PMMI and PACK EXPO.”